Thursday, 30 July, 2026
Chip Bottleneck Battle: ASE Ups 2026 Capex to Record $10.5B on AI Surge
By TechShots Studio
Taiwanese chip-packaging giant ASE Technology boosted its 2026 capital expenditure budget by another $2 billion, pushing it to a record $10.5 billion. Driven by soaring global demand for AI chips and advanced packaging, the company is aggressively scaling up its LEAP manufacturing capacity and expanding factory infrastructure to resolve critical semiconductor supply bottlenecks.