Friday, 24 March, 2023

Eliyan Corporation Closes $40M Series A Funding Round

<p>In order to market and sell its technology for multi-die chiplet integration, Eliyan Corporation, which is credited with developing the semiconductor industry&#39;s highest-performance and most efficient chiplet interconnect, today announced the completion of a $40 million Series A funding round and the successful tape-out of its technology on a 5-nanometer (nm) process. Eliyan&rsquo;s Series A round was led by Tracker Capital Management.</p>