Thursday, 8 October, 2026
Foundry Giants Team Up: GlobalFoundries to Build AI Chip Components for TSMC in New York
By TechShots Studio
In a $2 billion multi-year agreement, GlobalFoundries will manufacture silicon interposers—a critical component linking AI processors and memory chips—for TSMC at its Malta, New York facility. Set to scale volume production in early 2028, the partnership establishes the first U.S.-based supply for TSMC's CoWoS advanced packaging, easing vital AI supply chain bottlenecks.
Read full story at REUTERS