Wednesday, 23 September, 2026
Nexstrom Raises $12M to Bring 2D Semiconductor Manufacturing to Chip Fabs
By TechShots Studio
Singapore-based Nexstrom raised $12 million to develop equipment that can grow ultra-thin 2D semiconductor materials directly on 300mm wafers. Its technology aims to overcome silicon’s scaling limits and reduce power loss in future AI and high-performance chips. The startup is working toward commercial production between 2030 and 2035
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