Tuesday, 13 January, 2026
SK Hynix to Invest $13 Billion in Advanced Chip Packaging Plant in South Korea
South Korean memory chip giant SK Hynix has announced a massive $12.6 billion investment to build a state-of-the-art semiconductor packaging facility. This move aims to solidify its leadership in the High Bandwidth Memory (HBM) market, which is critical for artificial intelligence applications. By expanding its domestic manufacturing capacity, SK Hynix intends to meet surging global demand from AI pioneers.
Read full story at Economic Times