Wednesday, 10 June, 2026
Inside Samsung’s Blueprint to Supercharge the AI Chip Race
By TechShots Studio
Samsung Electronics is exploring a new, advanced semiconductor packaging facility in Gwangju, South Korea, to reinforce its position in the booming AI chip supply chain. Driven by soaring demand for High-Bandwidth Memory (HBM) chips from tech giants like Nvidia, the facility will optimize AI server performance. The official investment blueprint is expected to be unveiled on June 29, 2026, during a high-profile economic strategy meeting with South Korean President Lee Jae Myung.
Read full story at CIO ECONOMIC TIMES