Monday, 20 April, 2026
Odisha Boosts Semiconductor Ecosystem with New 3D Chip Packaging Unit
By Isha
Odisha has marked a significant milestone in India’s semiconductor journey with the establishment of its first 3D chip packaging facility. This advanced unit enhances the state’s high-tech manufacturing capabilities, focusing on sophisticated assembly and testing processes. By integrating 3D packaging technology, Odisha is positioning itself as a vital player in the global electronics supply chain, attracting further investments.
Read full story at Economic Times