Tuesday, 27 October, 2026
Packaging Power-Up: Applied Materials Deepens AI Chip Stake
By TechShots Studio
US chip-equipment giant Applied Materials is raising its stake in Dutch supplier BE Semiconductor Industries (Besi) to roughly 20%. This strategic partnership boosts joint development of advanced chip packaging and hybrid bonding technologies, which are essential for manufacturing next-generation AI processors and high-performance semiconductors.
Read full story at REUTERS