Sunday, 7 September, 2025
Ashwini Vaishnaw Demystifies Semiconductor Manufacturing in 52-Second Video
Union Minister Ashwini Vaishnaw shared a concise 52-second video detailing India's semiconductor manufacturing process. He explained that production begins with melting silica sand into pure silica ingots, which are then sliced into wafers. These wafers undergo design and fabrication to create individual chips. The final step is the Assembly, Testing, Marking, and Packaging (ATMP) process, culminating in a fully functional chip ready for deployment.
Read full story at Financial Express