Thursday, 22 October, 2026
No Hybrid Threat: Besi Dismisses ASML Rivalry Concerns as AI Orders Surge
By TechShots Studio
Semiconductor equipment maker Besi clarified that ASML is not a rival in hybrid bonding, noting ASML’s interest lies in 3D transistor stacking rather than die-to-wafer packaging tools. Driven by booming AI chip demand, Besi reported strong order momentum and announced a €100 million share buyback, reassuring investors following recent market speculation over potential competition.
Read full story at REUTERS