Thursday, 16 October, 2025
India Ships First Multi-Chip Power Module to U.S. Firm AOS
India has achieved a significant milestone in semiconductor manufacturing with the shipment of its first commercially packaged multi-chip module (MCM) to Alpha & Omega Semiconductor (AOS) in the U.S. Kaynes Semicon's Sanand facility, established under the India Semiconductor Mission 1.0, delivered 900 intelligent power modules (IPMs) comprising 17 integrated dies, including IGBTs, controller ICs, and diodes.
Read full story at Economic Times