Friday, 24 March, 2023
Intel is betting on its 3D chip tech to beat competition

<p>Intel, On Monday, displayed its new 3D chip technology and analysts said they have an edge over their competitors. Intel’s ‘chiplets’ are different from TSMC’s as they can take in a wider variety of chiplets and meld them together without a loss of performance. Another amazing feature giving Intel’s chiplets an upper hand in that they rest on top of copper columns, letting them suck up electricity more efficiently than other designs.</p> <p> </p>
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