Thursday, 12 November, 2026
Samsung’s $4.5B Packaging Push Set to Unlock $30B Equipment Wave
By TechShots Studio
South Korean President Lee Jae Myung announced that Samsung Electronics’ 6 trillion won ($4.48 billion) investment in an Asan high-bandwidth memory (HBM) packaging plant will trigger roughly 40 trillion won ($30 billion) in additional advanced equipment spending. Set to begin operations in June 2028—a year ahead of schedule—the facility aims to meet surging AI server memory demand and anchor South Korea’s broader semiconductor mega-projects.
Read full story at REUTERS