Monday, 24 August, 2026
Xiaomi Challenges Tech Giants with New TSMC-Built 3nm Chip
By TechShots Studio
Xiaomi has unveiled its new in-house smartphone processor, the Xring O3, to boost supply chain independence and lessen reliance on suppliers like Qualcomm. Manufactured using TSMC's advanced 3-nanometer process, the chip is expected to power Xiaomi's upcoming flagship foldable phone. This step aligns Xiaomi with giants like Apple, Samsung, and Huawei in custom chip development.
Read full story at CIO ECONOMIC TIMES